• Mfr Part Number: ZM-STG2
• Features:
• Extreme Performance: Ultra low thermal resistance and superior heat conductance maintain the highest performance level of heat transfer between the heat source and heatsink for maximized cooling performance
•  ... more

Specifications

• Mfr Part Number: MX-3
• Features:
• High Thermal Conductivity
• Low Thermal Resistance
• Non-Electrical Conductive
• Non-Capacitive
• Non-Curing
• Non-Corrosive
• No Bleeding
• Odorless
• Application: CPU, GPU and other applications between power semiconductor components ... more

• Mfr Part Number: MATRIX
• Features:
• Thermal Matrix: The unique blend of micronized Zinc Oxide, Aluminum Oxide, and Aluminum particles in silicone base oil forms a thermally conductive matrix that provides class-leading performance and ... more

• Mfr Part Number: HTK-002-U1
• Features:
• Suitable for CPU, chipsets on Mainboard, VGA card, etc
• Easy to use
• Zif Socket Templates ensure correct applying area with various CPU socket types
• Produces an even layer when using applicator
• Dielectric
• Wide ... more

• Mfr Part Number: CAN-60ML
• Unique 2-Step Process
• ArctiClean 1 Thermal Material Cleaner
• ArctiClean 2 Thermal Surface Purifier
• Volume: 30ml Arcticlean 1 And 30ml Arcticlean 2 (Total 60ml)
• Package: Bulk

• Mfr Part Number: AS5-12G
• Features:
• Contains 99.9% pure silver
• High-Density(contains over 88% thermally conductive filler by weight)
• Controlled Tripple-Phase Viscosity
• Not Electrically Conductive and Absolute Stability (will not separate, run, ... more

• Mfr Part Number: SILVER THERMAL COMPOUND
• Made with 99.9% pure micronized silver
• 88% silver content by weight
• Extended temperature limits: -50°C ~ 180°C
• Thermal Conductivity: > 350,000 W/m²°C
• Thermal Resistance:< 0.0045°C-in²/W

• Mfr Part Number: CMQ-22G
• Features:
• High-Density ceramic content
• Controlled Triple-Phase Viscosity
• Excellent Stability
• Electrical Insulator
• Easy Clean Up
• Innovative Dispenser
• RoHS Compliant
• Thermal Resistance:<0.007°C-in²/Watt (0.001 inch layer)
• Thermal ... more

• Mfr Part Number: AA-14G
• Features:
• Made with micronized aluminum oxide and boron nitride
• Controlled triple phase viscosity
• Absolute Stability: Arctic Alumina will not separate, run, migrate, or bleed
• Electrical Insulator: Arctic Alumina Compound is ... more

• Mfr Part Number: ZM-STG1
• Features:
• Best Performance: Maximizes heat transfer by eliminating any minute air gaps between the heat source and the heat sink caused by their irregular surfaces
• Ease of use: The brush applicator attached to the cap ... more

Specifications

• Mfr Part Number: MX-2
• Application: CPU, GPU and other applications between power semiconductor components and heat sinks.
• Features:
• High Thermal Conductivity
• Low Thermal Resistance
• Non-Electrical Conductive
• Non-Capacitive
• Non-Curing
• Non-Corrosive
• No ... more

Specifications

• Mfr Part Number: AS5-3.5G
• Features: Contains 99.9% pure silver, High-Density(contains over 88% thermally conductive filler by weight), Controlled Tripple-Phase Viscosity, Not Electrically Conductive and Absolute Stability (will not separate, ... more